Soldering Guidelines for Photodetectors
Parameter Recommended Value
Soldering iron tip temp < 260 °C (max 300 °C)
Contact time < 3–5 seconds per pin
Reflow temp (if SMT) < 260 °C peak (typical JEDEC)
Preheat recommendation ~100–150 °C if applicable
Cooling Avoid rapid cooling (no shock)
ESD Sensitivity Levels
Photodetector Type Typical ESD Threshold
Si PIN diode ~250–1000 V (Class 1B–1C)
Si APD ~100–500 V (Class 1A–1B)
InGaAs PIN/APD <100 V (often Class 0)
Ge PIN ~100–500 V
Unpackaged die <50 V (Class 0)
Class 0 = extremely sensitive; Class 1C = relatively tolerant
(per JEDEC JESD22-A114 standards)
Recommended ESD Protection Measures
1. Workstation Setup -Use grounded wrist straps, antistatic mats, and ionizers. All tools, fixtures, and benches must be grounded. Handle in an ESD-safe zone only
2. Handling Procedures -Always store photodetectors in ESD-safe packaging (e.g., pink foam, conductive trays, Faraday cages). Never touch leads or exposed die — use plastic-tipped or vacuum tweezers. Ground yourself and any tool before contact
3. PCB Design- Place ESD protection diodes (e.g., TVS, clamping diodes) on input lines. For APDs or PINs with bias, use RC filters to suppress transients. Keep lead length short to reduce antenna effect
4. Packaging & Shipping – Use shielded bags and clearly label as ESD-sensitive device. Include desiccants to avoid humidity-related charging effects
5. Signs of ESD Damage in Photodetectors – Loss of responsivity, Increased dark current. Shifts in breakdown voltage (for APDs). Total failure (open/short)
6. Summary Action Requirement – Workstation Grounded wrist strap + mat + ionizer
Recommended Minimum Bend Radius for SMF-28 with 0.9 mm Loose Tube:
Condition Minimum Bend Radius
Static (long-term) 15 mm (safe limit)
Dynamic (installation) 30 mm (recommended)
Absolute minimum (short, careful bend) ~10 mm, but not recommended for reliability